Fix KiCad file syntax - remove invalid comments and add proper property formatting
This commit is contained in:
@@ -62,9 +62,6 @@
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)
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;; =====================================================
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;; BOARD OUTLINE - 45mm x 35mm with rounded corners
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;; =====================================================
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(gr_arc (start 3 0) (mid 0.879 0.879) (end 0 3) (layer "Edge.Cuts") (width 0.15))
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(gr_line (start 3 0) (end 42 0) (layer "Edge.Cuts") (width 0.15))
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(gr_arc (start 45 3) (mid 44.121 0.879) (end 42 0) (layer "Edge.Cuts") (width 0.15))
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@@ -74,16 +71,8 @@
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(gr_arc (start 0 32) (mid 0.879 34.121) (end 3 35) (layer "Edge.Cuts") (width 0.15))
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(gr_line (start 0 32) (end 0 3) (layer "Edge.Cuts") (width 0.15))
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;; =====================================================
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;; COMPONENT PLACEMENT (all coordinates in mm from top-left)
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;; Front = component side (facing room)
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;; Back = wall side
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;; =====================================================
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;; --- BACK SIDE (facing wall) ---
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;; ESP32-S3-WROOM-1 - center of board, back side
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;; Module is 18x25.5mm, antenna at top extending past board edge
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(footprint "RF_Module:ESP32-S3-WROOM-1"
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(layer "B.Cu")
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(at 22.5 18 0)
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@@ -92,7 +81,6 @@
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(property "JLCPCB" "C2913202")
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)
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;; AMS1117-3.3 LDO - bottom right, back side
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(footprint "Package_TO_SOT_SMD:SOT-223-3_TabPin2"
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(layer "B.Cu")
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(at 38 30 0)
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@@ -101,7 +89,6 @@
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(property "JLCPCB" "C6186")
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)
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;; AP2112K-1.8 (camera DOVDD) - top right, back side
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(footprint "Package_TO_SOT_SMD:SOT-23-5"
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(layer "B.Cu")
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(at 38 5 0)
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@@ -110,7 +97,6 @@
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(property "JLCPCB" "C51118")
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)
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;; AP2112K-2.8 (camera AVDD) - top right, back side
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(footprint "Package_TO_SOT_SMD:SOT-23-5"
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(layer "B.Cu")
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(at 38 10 0)
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@@ -119,7 +105,6 @@
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(property "JLCPCB" "C51114")
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)
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;; USB ESD Protection
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(footprint "Package_TO_SOT_SMD:SOT-23-6"
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(layer "B.Cu")
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(at 22.5 32 0)
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@@ -128,9 +113,7 @@
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(property "JLCPCB" "C7519")
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)
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;; --- FRONT SIDE (facing room) ---
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;; USB-C connector - bottom center, front side
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(footprint "Connector_USB:USB_C_Receptacle_GCT_USB4125"
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(layer "F.Cu")
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(at 22.5 35 180)
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@@ -139,7 +122,6 @@
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(property "JLCPCB" "C2765186")
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)
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;; FPC camera connector - top center, front side
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(footprint "Connector_FFC-FPC:Molex_503480-2400_1x24-1MP_P0.50mm_Horizontal"
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(layer "F.Cu")
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(at 22.5 2 0)
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@@ -148,7 +130,6 @@
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(property "JLCPCB" "C2856805")
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)
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;; LD2410C header - right side, front
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(footprint "Connector_PinHeader_1.27mm:PinHeader_1x05_P1.27mm_Vertical"
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(layer "F.Cu")
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(at 42 17.5 90)
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@@ -156,7 +137,6 @@
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(property "Value" "LD2410C")
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)
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;; AM312 PIR header - left side, front
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(footprint "Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical"
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(layer "F.Cu")
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(at 3 15 90)
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@@ -164,7 +144,6 @@
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(property "Value" "AM312_PIR")
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)
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;; SHT41 - left edge, front (away from ESP32 heat)
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(footprint "Sensor_Humidity:Sensirion_DFN-4-1EP_1.5x1.5mm_P0.8mm_EP0.5x0.5mm"
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(layer "F.Cu")
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(at 4 28 0)
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@@ -173,7 +152,6 @@
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(property "JLCPCB" "C2911456")
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)
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;; BH1750 - left of center, front
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(footprint "Package_SO:WSOF-6_1.4x1.7mm_P0.5mm"
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(layer "F.Cu")
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(at 12 22 0)
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@@ -182,7 +160,6 @@
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(property "JLCPCB" "C78960")
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)
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;; Status LED - front side, visible
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(footprint "LED_SMD:LED_0402_1005Metric"
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(layer "F.Cu")
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(at 40 28 0)
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@@ -191,9 +168,7 @@
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(property "JLCPCB" "C2286")
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)
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;; --- PASSIVE COMPONENTS (back side, near their ICs) ---
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;; Input cap - near AMS1117
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(footprint "Capacitor_SMD:C_0805_2012Metric"
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(layer "B.Cu")
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(at 33 30 0)
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@@ -201,7 +176,6 @@
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(property "Value" "10uF")
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)
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;; Output cap - near AMS1117
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(footprint "Capacitor_SMD:C_0805_2012Metric"
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(layer "B.Cu")
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(at 33 33 0)
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@@ -209,7 +183,6 @@
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(property "Value" "22uF")
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)
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;; Decoupling caps - near ESP32
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(footprint "Capacitor_SMD:C_0402_1005Metric"
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(layer "B.Cu")
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(at 15 8 0)
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@@ -235,7 +208,6 @@
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(property "Value" "10uF")
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)
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;; Camera power caps
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(footprint "Capacitor_SMD:C_0805_2012Metric"
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(layer "B.Cu")
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(at 35 3 0)
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@@ -249,7 +221,6 @@
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(property "Value" "100nF")
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)
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;; LD2410C decoupling
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(footprint "Capacitor_SMD:C_0805_2012Metric"
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(layer "B.Cu")
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(at 40 15 0)
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@@ -257,7 +228,6 @@
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(property "Value" "10uF")
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)
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;; SHT41 decoupling
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(footprint "Capacitor_SMD:C_0402_1005Metric"
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(layer "F.Cu")
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(at 7 28 0)
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@@ -265,7 +235,6 @@
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(property "Value" "100nF")
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)
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;; BH1750 decoupling
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(footprint "Capacitor_SMD:C_0402_1005Metric"
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(layer "F.Cu")
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(at 15 22 0)
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@@ -273,7 +242,6 @@
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(property "Value" "100nF")
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)
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;; Resistors
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(footprint "Resistor_SMD:R_0402_1005Metric"
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(layer "F.Cu")
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(at 38 28 0)
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@@ -303,7 +271,6 @@
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(property "Description" "I2C SCL pull-up")
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)
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;; Buttons - back side, accessible via pinhole
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(footprint "Button_Switch_SMD:SW_SPST_PTS810"
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(layer "B.Cu")
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(at 5 33 0)
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@@ -317,7 +284,6 @@
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(property "Value" "RESET")
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)
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;; Mounting holes
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(footprint "MountingHole:MountingHole_2.2mm_M2_Pad"
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(layer "F.Cu")
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(at 2.5 2.5 0)
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@@ -331,9 +297,6 @@
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(property "Value" "MountingHole")
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)
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;; =====================================================
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;; SILKSCREEN LABELS
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;; =====================================================
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(gr_text "Presence Sensor v1.0"
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(at 22.5 17.5 0)
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(layer "F.SilkS")
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@@ -365,10 +328,6 @@
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(effects (font (size 0.8 0.8) (thickness 0.15)) (justify center))
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)
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;; =====================================================
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;; ANTENNA KEEP-OUT ZONE
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;; ESP32-S3 antenna at top of module - no copper
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;; =====================================================
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(gr_rect (start 13 0) (end 32 6)
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(layer "F.SilkS") (width 0.15) (fill none)
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)
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